I-SEMICONDUCTOR MATERIAL DESIGIN

Onjiniyela bethu bokuklama impahla ye-semiconductor basebenzisa amamojula esofthiwe athile ahlinzeka ngamathuluzi azinikele okuhlaziya ukusebenza kwedivayisi ye-semiconductor ezingeni eliyisisekelo le-physics. Amamojula anjalo asuselwe kuzibalo ze-drift-diffusion, kusetshenziswa amamodeli ezokuthutha e-isothermal noma angekho-nonisothermal. Amathuluzi anjalo e-software awusizo ekufaniseni uhla lwamadivayisi asebenzayo, okuhlanganisa ama-bipolar transistors (BJTs), metal-semiconductor field-effect transistors (MESFETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors ( I-IGBTs), ama-Schottky diode, nama-PN junctions. Imiphumela ye-Multiphysics idlala indima ebalulekile ekusebenzeni kwedivayisi ye-semiconductor. Ngamathuluzi esofthiwe anamandla kangaka, singakha kalula amamodeli afaka imiphumela eminingi yomzimba. Isibonelo, imiphumela yokushisa ngaphakathi kwedivayisi yamandla ingenziwa kusetshenziswa isixhumi esibonakalayo se-physics yokudlulisa ukushisa. Ukuguqulwa kokubona kungahlanganiswa ukuze kulingise uhla lwamadivayisi afana namaseli elanga, ama-light-emitting diode (ama-LED), nama-photodiodes (PDs). Isofthiwe yethu ye-semiconductor isetshenziselwa ukumodela amadivayisi we-semiconductor anezilinganiso zobude ezingu-100 we-nm noma ngaphezulu. Ngaphakathi kwesofthiwe, kunenombolo yokuxhumana yefiziksi - amathuluzi okuthola okokufaka kwemodeli ukuchaza isethi yezibalo ezibonakalayo nezimo zemingcele, ezifana nezindawo zokubonisa ukuthuthwa kwama-electron nezimbobo kumadivayisi asebenzisa isemiconductor, ukuziphatha kwawo kwe-electrostatic...njll. Isixhumi esibonakalayo sesemiconductor sixazulula isibalo se-Poisson ngokuhlanganyela nezibalo zokuqhubeka kukho kokubili ukugxiliswa kwe-electron ne-hole charge carriers ngokucacile. Singakhetha ukuxazulula imodeli ngendlela yevolumu elinganiselwe noma indlela ye-elementi elinganiselwe. I-interface ihlanganisa amamodeli wezinto ezibonakalayo ze-semiconducting ne-insulating materials, ngaphezu kwezimo zomngcele zoxhumana nabo be-ohmic, oxhumana nabo be-Schottky, amasango, kanye nezimo eziningi zemingcele ye-electrostatic. Izici ezingaphakathi kwesixhumi esibonakalayo zichaza impahla yokuhamba njengoba inqunyelwe ukusakazeka kwabathwali ngaphakathi kwempahla. Ithuluzi lesofthiwe lihlanganisa amamodeli okuhamba achazwe ngaphambilini kanye nenketho yokudala ngokwezifiso, amamodeli okuhamba achazwe umsebenzisi. Zombili lezi zinhlobo zamamodeli zingahlanganiswa ngezindlela ezingafanele. Imodeli ngayinye yokuhamba ichaza i-electron ephumayo kanye nokuhamba kwembobo. Ukuhamba okukhiphayo kungasetshenziswa njengokufaka kwamanye amamodeli okunyakaza, kuyilapho izibalo zingasetshenziswa ukuhlanganisa ukuhamba. I-interface futhi iqukethe izici zokwengeza i-Auger, Direct, kanye ne-Shockley-Read Hall recombination esizindeni se-semiconducting, noma ivumela ukucacisa izinga lethu lokuhlanganisa kabusha. Ukusatshalaliswa kwe-Doping kudinga ukucaciswa ukuze kwenziwe imodeli yamadivayisi we-semiconductor. Ithuluzi lethu lesoftware linikeza isici semodeli ye-doping ukwenza lokhu. Amaphrofayili ahlala njalo kanye nawe-doping achazwe yithi angacaciswa, noma iphrofayili ye-Gaussian doping elinganiselwe ingasetshenziswa. Singangenisa futhi idatha emithonjeni yangaphandle. Ithuluzi lethu lesofthiwe linikeza amandla athuthukisiwe e-Electrostatics. Isizindalwazi esibalulekile sikhona nezakhiwo zezinto ezimbalwa.

 

PROCESS TCAD kanye ne-DEVICE TCAD

I-Technology-Aided Design (TCAD) ibhekisela ekusetshenzisweni kwezifaniso zekhompiyutha zokuthuthukisa nokuthuthukisa ubuchwepheshe bokucubungula i-semiconductor namadivayisi. Ukumodela kokwenziwa kubizwa ngokuthi I-Process TCAD, kuyilapho ukumodela komsebenzi wedivayisi kubizwa ngokuthi i-Device TCAD. Inqubo ye-TCAD namathuluzi okulingisa idivayisi asekela uhla olubanzi lwezinhlelo zokusebenza ezifana ne-CMOS, amandla, inkumbulo, izinzwa zesithombe, amaseli elanga, namadivayisi e-analog/RF. Njengesibonelo, uma ucabangela ukuthuthukisa amaseli elanga ayinkimbinkimbi asebenza kahle kakhulu, ukucabangela ithuluzi le-TCAD lezentengiselwano lingakongela isikhathi sokuthuthukisa futhi kunciphise inani lokuqalwa kokwenza isilingo esibizayo. I-TCAD inikeza ukuqonda mayelana nezimo eziyisisekelo ezithinta ukusebenza nokukhiqiza. Kodwa-ke, ukusebenzisa i-TCAD kudinga ukuthenga nokunikeza ilayisense amathuluzi esofthiwe, isikhathi sokufunda ithuluzi le-TCAD, ngisho nangokwengeziwe ukuba uchwepheshe kanye nokukhuluma kahle ngethuluzi. Lokhu kungabiza kakhulu futhi kube nzima uma ungeke usebenzise le softhiwe ngokuqhubekayo noma isikhathi eside. Kulezi zimo singakusiza ukuthi unikeze isevisi yonjiniyela bethu abasebenzisa lawa mathuluzi nsuku zonke. Xhumana nathi ukuze uthole ulwazi olwengeziwe.

 

I-SEMICONDUCTOR PROCESS DESIGN

Kunezinhlobo eziningi zemishini nezinqubo ezisetshenziswa embonini ye-semiconductor. Akulula noma umqondo omuhle ukuhlale ucabanga ukuthenga uhlelo lokhiye wokuvula olunikezwa emakethe. Ngokuya ngokusetshenziswa kanye nezinto ezisetshenziswayo ezicatshangelwayo, impahla ye-semiconductor capital idinga ukukhethwa ngokucophelela futhi ihlanganiswe emugqeni wokukhiqiza. Kudingeka onjiniyela abakhethekile nabanolwazi ukuze bakhe ulayini wokukhiqiza womkhiqizi wedivayisi ye-semiconductor. Onjiniyela bethu abakhethekile bangakusiza ngokudizayina i-prototyping noma ulayini wokukhiqiza ngobuningi olingana nesabelomali sakho. Singakusiza ukuthi ukhethe izinqubo ezifanele kakhulu nezinto zokusebenza ezihlangabezana nokulindelekile kwakho. Sizokuchazela ngobuhle bemishini ethile futhi sikusize kuzo zonke izigaba zokusungula i-prototyping yakho noma ulayini wokukhiqiza ngobuningi. Singakuqeqesha ngolwazi futhi sikwenze ulungele ukusebenzisa ulayini wakho. Konke kuncike ezidingweni zakho. Singakha isixazululo esingcono kakhulu esimweni ngasinye. Ezinye izinhlobo ezinkulu zamathuluzi asetshenziswa ekwenziweni kwedivayisi ye-semiconductor amathuluzi e-photolithographic, amasistimu wokubeka, amasistimu e-etching, amathuluzi ahlukahlukene okuhlola kanye nezinhlamvu……njll. Iningi lalawa mathuluzi kuwutshalomali olungathi sína futhi izinkampani azikwazi ukubekezelela izinqumo ezingalungile, ikakhulukazi izindwangu lapho ngisho namahora ambalwa okuphumula angaba yingozi. Enye yezinselelo okungenzeka ukuthi izikhungo eziningi zibhekene nazo ukuqinisekisa ukuthi ingqalasizinda yazo yemishini yenziwa ifanelekele ukumumatha okokusebenza kwe-semiconductor. Kuningi okudinga ukubuyekezwa ngokucophelela ngaphambi kokwenza isinqumo esiqinile sokufaka imishini ethile noma ithuluzi leqoqo, okuhlanganisa izinga lamanje legumbi elihlanzekile, ukuthuthukiswa kwegumbi elihlanzekile uma kudingeka, ukuhlela amandla kanye nemigqa yegesi eyandulelayo, i-ergonomy, ukuphepha. , ukulungiselelwa kokusebenza….etc. Khuluma nathi kuqala ngaphambi kokungena kulezi zimali. Ukuthi izinhlelo zakho namaphrojekthi abuyekezwe onjiniyela bethu abanolwazi lwendwangu ye-semiconductor kanye nabaphathi kuzoba nomthelela omuhle kuphela emizamweni yakho yebhizinisi.

 

UKUHLOLWA KWEZINTO ZAMA-SEMICONDUCTOR NAMADIVAYISI

Ngokufana nobuchwepheshe bokucubungula i-semiconductor, ukuhlolwa kanye ne-QC yezinto zokwakha ze-semiconductor namadivayisi kudinga imishini ekhetheke kakhulu nolwazi lobunjiniyela. Sisebenzela amaklayenti ethu kule ndawo ngokunikeza isiqondiso sochwepheshe kanye nokubonisana nohlobo lwemishini yokuhlola ne-metrology ehamba phambili neyonga kakhulu ohlelweni oluthile, ukunquma nokuqinisekisa ukufaneleka kwengqalasizinda endaweni yamakhasimende…..njll. Amazinga okungcoliswa kwegumbi ahlanzekile, ukudlidliza phansi, izikhombisi-ndlela zokuhamba komoya, ukunyakaza kwabantu,….etc. zonke zidinga ukuhlolwa nokuhlolwa ngokucophelela. Singase futhi sihlole amasampula akho ngokuzimela, sinikeze ukuhlaziya okuningiliziwe, sinqume imbangela yokwehluleka… njll. njengomhlinzeki wesevisi yenkontileka yangaphandle. Kusukela ekuhlolweni kwe-prototype kuya ekukhiqizweni kwesikali esigcwele, singakusiza uqinisekise ubumsulwa bezinto zokuqala, singasiza ukunciphisa isikhathi sokuthuthukiswa nokuxazulula izinkinga zokukhiqiza endaweni yokukhiqiza ye-semiconductor.

 

Onjiniyela bethu be-semiconductor basebenzisa isofthiwe elandelayo namathuluzi okulingisa ngenqubo ye-semiconductor kanye nomklamo wedivayisi:

• I-ANSYS RedHawk / Q3D Extractor / Totem / PowerArtist

• I-MicroTec SiDif / SemSim / SibGraf

• I-COMSOL Semiconductor Module

 

Siyakwazi ukufinyelela uhla olubanzi lwemishini yelebhu ethuthukisiwe ukuze sithuthukise futhi sihlole izinto zokwakha ze-semiconductor namadivayisi, okuhlanganisa:

• I-Ion Mass Spectrometry yesibili (SIMS), Isikhathi Sendiza ye-SIMS (TOF-SIMS)

• I-Transmission Electron Microscopy – Scanning Transmission Electron Microscopy (TEM-STEM)

• Iskena i-Electron Microscopy (SEM)

• I-X-Ray Photoelectron Spectroscopy – Electron Spectroscopy yokuhlaziywa kwamakhemikhali (XPS-ESCA)

• I-Gel Permeation Chromatography (GPC)

• I-High Performance Liquid Chromatography (HPLC)

• I-Gas Chromatography – Mass Spectrometry (GC-MS)

• I-Inductively Coupled Plasma Mass Spectrometry (ICP-MS)

• I-Glow Discharge Mass Spectrometry (GDMS)

• I-Laser Ablation Inductively Coupled Plasma Mass Spectrometry (LA-ICP-MS)

• I-Liquid Chromatography Mass Spectrometry (LC-MS)

• I-Auger Electron Spectroscopy (AES)

• I-Energy Dispersive Spectroscopy (EDS)

• I-Fourier Transform Infrared Spectroscopy (FTIR)

• I-Electron Energy Loss Spectroscopy (EELS)

• I-Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)

• Raman

• I-X-Ray Diffraction (XRD)

• I-X-Ray Fluorescence (XRF)

• I-Atomic Force Microscopy (AFM)

• I-Dual Beam - I-Ion Beam Egxilisiwe (I-Dual Beam - FIB)

• I-Electron Backscatter Diffraction (EBSD)

• Iphrofayili ye-Optical

• Ukuhlaziywa Kwegesi Esalelayo (i-RGA) Nokuqukethwe Komhwamuko Wamanzi Wangaphakathi

• I-Instrumental Gas Analysis (IGA)

• URutherford Backscattering Spectrometry (RBS)

• I-Total Reflection X-Ray Fluorescence (TXRF)

• I-Specular X-Ray Reflectivity (XRR)

• I-Dynamic Mechanical Analysis (DMA)

• I-Destructive Physical Analysis (DPA) ithobelana nezimfuneko ze-MIL-STD

• I-Differential Scanning Calorimetry (DSC)

• Ukuhlaziywa kwe-Thermogravimetric (TGA)

• Ukuhlaziywa kweThermomechanical (TMA)

• Isikhathi Sangempela X-Ray (RTX)

• Iskena i-Acoustic Microscopy (SAM)

• Ukuhlolwa kokuhlola izakhiwo zikagesi

• Ukuhlolwa Komzimba Nokusebenza

• Okunye Ukuhlola Okushisayo Njengoba Kudingeka

• Chambers Environmental, Ukuguga Ukuhlolwa

 

Okunye ukuhlola okuvamile esikwenzayo kuma-semiconductors namadivayisi enziwe ngawo yilezi:

• Ukuhlola ukusebenza kahle kokuhlanza ngokulinganisa izinsimbi ezingaphezulu kumawafa we-semiconductor

• Ukuhlonza nokuthola ukungcola kweleveli yokulandela kanye nokungcoliswa kwezinhlayiyana kumadivayisi we-semiconductor

• Isilinganiso sokuqina, ukuminyana, kanye nokwakheka kwamafilimu amancane

• Ukucaciswa komthamo we-dopant kanye nokuma kwephrofayela, ukulinganisa ama-dopant ngobuningi nokungcola

• Ukuhlolwa kokwakheka kwezigaba ezihlukene zama-IC

• Imephu enezinhlangothi ezimbili yezinto ze-matrix kusisetshenziswa semiconductor nge-Scanning Transmission Electron Microscopy-Electron Energy Loss Spectroscopy (STEM-EELS)

• Ukuhlonzwa kokungcola ezindaweni kusetshenziswa i-Auger Electron Spectroscopy (FE-AES)

• Ukuhlola ngeso lengqondo kanye nokulinganisa kwe-surface morphology

• Ukuhlonza inkungu ye-wafer kanye nokushintsha kombala

• Ubunjiniyela be-ATE kanye nokuhlola ukukhiqizwa nokuthuthukiswa

• Ukuhlolwa komkhiqizo we-semiconductor, ukushiswa nokufaneleka kokwethembeka ukuze kuqinisekiswe ukufaneleka kwe-IC