I-SEMICONDUCTOR MATERIAL UYILO

Iinjineli zethu zoyilo lwezixhobo zesemiconductor zisebenzisa iimodyuli ezithile zesoftware ezibonelela ngezixhobo ezizinikeleyo zokuhlalutya ukusebenza kwesixhobo se-semiconductor kwinqanaba elisisiseko lefiziksi. Iimodyuli ezinjalo zisekwe kwi-equation ye-drift-diffusion equations, isebenzisa imodeli yezothutho ye-isothermal okanye i-nonisothermal. Ezo zixhobo zesoftware ziluncedo ekulinganiseni uluhlu lwezixhobo ezisebenzayo, kubandakanya i-bipolar transistors (BJTs), i-metal-semiconductor field-effect transistors (MESFETs), i-metal-oxide-semiconductor field-effect transistors (MOSFETs), i-insulated-gate bipolar transistors ( IGBTs), Schottky diodes, kunye nePN junctions. Iziphumo zeMultiphysics zidlala indima ebalulekileyo ekusebenzeni kwesixhobo se-semiconductor. Ngezixhobo ezinamandla zesoftware, sinokwenza ngokulula iimodeli ezibandakanya iziphumo zomzimba ezininzi. Umzekelo, iziphumo zobushushu ngaphakathi kwesixhobo samandla zinokulinganiswa kusetyenziswa ujongano lobushushu bokudlulisa ubushushu. Utshintsho lwe-Optical lunokudityaniswa ukulinganisa uluhlu lwezixhobo ezifana neeseli zelanga, i-light-emitting diodes (LEDs), kunye neefotodiodes (PDs). Isoftware yethu yesemiconductor isetyenziselwa ukwenza imodeli yezixhobo zesemiconductor ezinezikali zobude be-100's ye-nm okanye ngaphezulu. Ngaphakathi kwe-software, kukho inani le-interfaces ye-physics-izixhobo zokufumana igalelo lemodeli ukuchaza isethi yee-equations zomzimba kunye neemeko zemida, ezifana ne-interfaces yokwenza imodeli yothutho lwee-electron kunye nemingxuma kwizixhobo ze-semiconductor, ukuziphatha kwabo kwe-electrostatic ... njl. I-interface ye-semiconductor isombulula i-equation ye-Poisson ngokubambisana ne-equation eqhubekayo kuzo zombini i-electron kunye ne-hole charge carrier concentrations ngokucacileyo. Sinokukhetha ukusombulula imodeli ngendlela yevolyum elinganiselweyo okanye indlela yento elinganiselweyo. I-interface ibandakanya imodeli yezinto eziphathekayo ze-semiconducting kunye ne-insulating materials, ngaphezu kweemeko zemida yoqhagamshelwano lwe-ohmic, uqhagamshelwano lwe-Schottky, amasango, kunye noluhlu olubanzi lweemeko zomda we-electrostatic. Iimpawu ngaphakathi kwe-interface zichaza ipropati yokuhamba njengoko inqunyelwe ngokusasazwa kwabathwali ngaphakathi kwezinto. Isixhobo sesoftware sibandakanya iimodeli ezininzi zokushukumiseka ezichazwe kwangaphambili kunye nokukhetha ukwenza isiko, iimodeli zokushukumiseka ezichazwe ngumsebenzisi. Zombini ezi ntlobo zeemodeli zinokudibaniswa ngeendlela ezingafanelekanga. Imodeli nganye yokuhamba ichaza i-electron ephumayo kunye nokuhamba komngxuma. Ukuhamba kwemveliso kunokusetyenziswa njengegalelo kwezinye iimodeli zokuhamba, ngelixa i-equations ingasetyenziselwa ukudibanisa ukuhamba. I-interface iqulethe iimpawu zokongeza i-Auger, i-Direct, kunye ne-Shockley-Read Hall recombination kwi-domain semiconducting, okanye ivumela ukucacisa izinga lethu lokuphinda lidibanise. Ukuhanjiswa kwe-doping kufuneka kucaciswe kumzekelo wezixhobo ze-semiconductor. Isixhobo sethu sesoftware sibonelela ngenqaku lemodeli yedoping ukwenza oku. Iiprofayili ezihlala rhoqo kunye ne-doping ezichazwe sithi zingachazwa, okanye iprofayile ye-doping ye-Gaussian eqikelelweyo ingasetyenziswa. Singakwazi ukungenisa idatha kwimithombo yangaphandle kwakhona. Isixhobo sethu sesoftware sibonelela ngezakhono eziphuculweyo ze-Electrostatics. Ugcino lwedatha olukhoyo luneempawu zemathiriyeli ezininzi.

 

INKQUBO ye-TCAD kunye ne-TCAD ye-DEVICE

ITekhnoloji yoYilo oluNcedayo kwiKhompyutha (TCAD) ibhekisa kusetyenziso lwezifaniso zekhompyuter zokuphuhlisa nokuphucula iitekhnoloji yokusetyenzwa kwe-semiconductor kunye nezixhobo. Ukwenziwa kwemodeli yokwenziwa kubizwa ngokuba yiNkqubo ye-TCAD, ngelixa imodeli yokusebenza kwesixhobo ibizwa ngokuba yi-Device TCAD. Inkqubo ye-TCAD kunye nezixhobo zokulinganisa izixhobo zixhasa uluhlu olubanzi lwezicelo ezifana ne-CMOS, amandla, imemori, izinzwa zemifanekiso, iiseli zelanga, kunye nezixhobo ze-analog / RF. Njengomzekelo, ukuba ucinga ukuphuhlisa iiseli zelanga ezintsonkothileyo ezisebenza kakhulu, ukuqwalasela isixhobo se-TCAD sorhwebo sinokukugcina ixesha lophuhliso kwaye sinciphise inani lovavanyo olubizileyo oluqhutywayo. I-TCAD ibonelela ngokuqonda kwizinto ezisisiseko zomzimba ezichaphazela ukusebenza kunye nesivuno. Nangona kunjalo, ukusebenzisa i-TCAD kufuna ukuthengwa kunye nokunikezelwa kwelayisenisi izixhobo zesoftware, ixesha lokufunda isixhobo se-TCAD, kwaye ngakumbi ukuba nobuchwephesha kunye nokusiqonda kakuhle isixhobo. Oku kunokuba yindleko kwaye kunzima ngokwenene ukuba awuyi kusebenzisa le software ngokuqhubekayo okanye ixesha elide. Kwezi meko sinokukunceda unikezele ngenkonzo yeenjineli zethu ezisebenzisa ezi zixhobo yonke imihla. Qhagamshelana nathi ngolwazi oluthe kratya.

 

Uyilo lweNKQUBO YE-SEMICONDUCTOR

Kukho iintlobo ezininzi zezixhobo kunye neenkqubo ezisetyenziswa kwishishini le-semiconductor. Akukho lula okanye ngumbono olungileyo ukuhlala ucinga ngokuthenga isitshixo sesitshixo esinikezelwa kwiimarike. Ngokuxhomekeke kwisicelo kunye nezinto eziqwalaselwayo, izixhobo ze-semiconductor capital kufuneka zikhethwe ngononophelo kwaye zihlanganiswe kumgca wokuvelisa. Iinjineli ezikhethekileyo nezinamava ziyafuneka ukwakha umgca wemveliso kumenzi wesixhobo sesemiconductor. Iinjineli zethu zenkqubo ekhethekileyo zinokukunceda ngokuyila iprototyping okanye umgca wokuvelisa ngobuninzi ohambelana nohlahlo lwabiwo-mali lwakho. Sinokukunceda ukhethe ezona nkqubo zifanelekileyo kunye nezixhobo ezihlangabezana nolindelo lwakho. Siza kukucacisela uncedo lwezixhobo ezithile kwaye sikuncede kuzo zonke izigaba zokuseka iprototyping yakho okanye umgca wokuvelisa ngobuninzi. Singakuqeqeshela ukwazi kwaye sikwenze ulungele ukusebenzisa umgca wakho. Konke kuxhomekeke kwiimfuno zakho. Singaqulunqa esona sisombululo silungileyo kwimeko nganye. Ezinye iintlobo eziphambili zezixhobo ezisetyenziswa kwimveliso yesixhobo se-semiconductor zizixhobo zefotolithographic, iinkqubo zokubeka, iisistim ze-etching, izixhobo ezahlukeneyo zovavanyo kunye neempawu……njl. Uninzi lwezi zixhobo lutyalo-mali olunzima kwaye iinkampani azikwazi ukunyamezela izigqibo ezingalunganga, ngakumbi iifabs apho neeyure ezimbalwa zokuphumla zinokuba yingozi. Omnye wemiceli mngeni izibonelelo ezininzi ezinokuthi zijamelane nazo kukuqinisekisa ukuba iziseko zophuhliso lwemizi-mveliso yazo zenziwe zafaneleka ukuze zikwazi ukwamkela izixhobo zenkqubo ye-semiconductor. Kuninzi kufuneka kuhlaziywe ngononophelo ngaphambi kokwenza isigqibo esiqinileyo ekufakeni isixhobo esithile okanye isixhobo seqela, kubandakanywa inqanaba langoku legumbi elicocekileyo, ukuphuculwa kwegumbi elicocekileyo xa kuyimfuneko, ukucwangciswa kwamandla kunye nemigca yegesi engaphambili, i-ergonomy, ukhuseleko. , ukulungiselelwa kokusebenza….etc. Thetha nathi kuqala phambi kokuba ungene kolu tyalo-mali. Ukuba nezicwangciso zakho kunye neeprojekthi zijongiwe ziinjineli zethu ze-semiconductor fab kunye nabaphathi baya kuba negalelo eliqinisekileyo kuphela kwiinzame zeshishini lakho.

 

UVAVANYO LWEZIXHOBO ZESEMICONDUCTOR KUNYE NEZIXHOBO

Ngokufana netekhnoloji yokucubungula i-semiconductor, uvavanyo kunye ne-QC yezixhobo ze-semiconductor kunye nezixhobo zifuna izixhobo ezikhethekileyo kunye nolwazi lobunjineli. Sisebenzela abathengi bethu kulo mmandla ngokubonelela ngesikhokelo sobuchwephesha kunye nokubonisana kuhlobo lovavanyo kunye nesixhobo se-metrology sesona sixhobo silungileyo nesona sinoqoqosho kwisicelo esithile, simisela kwaye siqinisekisa ukufaneleka kweziseko zoncedo kwindawo yomthengi…..etc. Amanqanaba ongcoliseko lwegumbi elicocekileyo, ukungcangcazela emgangathweni, indlela yokuhamba komoya, ukuhamba kwabantu,….etc. zonke kufuneka zihlolwe ngononophelo kwaye zivavanywe. Sinokuzivavanya ngokuzimeleyo iisampulu zakho, sinikeze uhlalutyo oluneenkcukacha, sigqibe unobangela wokusilela… njl. njengomboneleli ngenkonzo wekhontrakthi yangaphandle. Ukusuka kuvavanyo lweprototype ukuya kwimveliso epheleleyo, sinokukunceda uqinisekise ubunyulu bezinto zokuqala, sinokunceda ukunciphisa ixesha lophuhliso kunye nokusombulula iingxaki zesivuno kwindawo yokuvelisa i-semiconductor.

 

Iinjineli zethu ze-semiconductor zisebenzisa le software ilandelayo kunye nezixhobo zokulinganisa inkqubo ye-semiconductor kunye noyilo lwesixhobo:

• ANSYS RedHawk / Q3D Extractor / Totem / PowerArtist

• MicroTec SiDif / SemSim / SibGraf

• Imodyuli ye-COMSOL yeSemiconductor

 

Sinokufikelela kuluhlu olubanzi lwezixhobo zelebhu eziphambili ukuphuhlisa nokuvavanya izixhobo zesemiconductor kunye nezixhobo, kubandakanya:

• I-Ion Mass Spectrometry (SIMS), Ixesha leFlight SIMS (TOF-SIMS)

• IMikroskopu ye-Electron yoThumelo-Iskeni lokuThunyelwa kwe-Electron Microscopy (TEM-STEM)

• Ukuskena i-Electron Microscopy (SEM)

• X-Ray Photoelectron Spectroscopy – Electron Spectroscopy for Chemical analysis (XPS-ESCA)

• I-Gel Permeation Chromatography (GPC)

• I-High Performance Liquid Chromatography (HPLC)

• IChromatography yerhasi – Mass Spectrometry (GC-MS)

• I-Inductively Coupled Plasma Mass Spectrometry (ICP-MS)

• Ukukhutshwa okukhazimlayo kweMisa yeSpectrometry (GDMS)

• ILaser Ablation inductively Coupled Plasma Mass Spectrometry (LA-ICP-MS)

• ILiquid Chromatography Mass Spectrometry (LC-MS)

• I-Auger Electron Spectroscopy (AES)

• I-Energy Dispersive Spectroscopy (EDS)

• I-Fourier Transform Infrared Spectroscopy (FTIR)

• I-Electron Energy Loss Spectroscopy (EELS)

• I-Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)

• Raman

• I-X-Ray Diffraction (XRD)

• I-X-Ray Fluorescence (XRF)

• I-Atomic Force Microscopy (AFM)

• Umtha oMabini-iBeam eGxinisiweyo ye-Ion (iBeam eDual – FIB)

• I-Electron Backscatter Diffraction (EBSD)

• I-Optical Profileometry

• Uhlahlelo lwerhasi eshiyekileyo (RGA) kunye nesiqulatho soMphunga waManzi waNgaphakathi

• Uhlalutyo lwegesi yesixhobo (IGA)

• URutherford Backscattering Spectrometry (RBS)

• Iyonke iReflection X-Ray Fluorescence (TXRF)

• Ukubonakaliswa kweX-Ray okuKhethekileyo (XRR)

• Uhlahlelo lweMechanical Dynamic (DMA)

• Uhlahlelo loMzimba olonakalisayo (DPA) luhambelana neemfuno ze-MIL-STD

• Umahluko wokuSkena ngeKhalorimitha (DSC)

• Uhlalutyo lweThermogravimetric (TGA)

• Uhlalutyo lweThermomechanical (TMA)

• Ixesha lokwenyani X-Ray (RTX)

• Ukuskena i-Acoustic Microscopy (SAM)

• Uvavanyo lokuvavanya iipropati zombane

• Uvavanyo loMzimba kunye noomatshini

• Olunye uvavanyo lweThermal njengoko kufuneka

• Amagumbi okusingqongileyo, iimvavanyo zokuguga

 

Olunye lweemvavanyo eziqhelekileyo esizenzayo kwiisemiconductors kunye nezixhobo ezenziwe ngazo zezi:

• Ukuvavanya ukusebenza kakuhle kokucoca ngokulinganisa iintsimbi ezingaphezulu kwi-semiconductor wafers

• Ukuchonga kunye nokufumana indawo yokungcola kwinqanaba kunye nokungcoliseka kwamasuntswana kwizixhobo ze-semiconductor

• Umlinganiselo wobunzima, ubuninzi, kunye nokwakheka kweefilimu ezincinci

• Ubume bedosi ye-dopant kunye nokumila kweprofayili, ukulinganisa i-dopants eninzi kunye nokungcola

• Uvavanyo lwe-cross-sectional structure ye-ICs

• Imephu enemilinganiselo emibini yezinto zematrix kwisixhobo semiconductor ngokuskena uThutho lwe-Electron Microscopy-Electron Energy Loss Spectroscopy (STEM-EELS)

• Ukuchongwa kongcoliseko kwiindlela zokujongana kusetyenziswa iAuger Electron Spectroscopy (FE-AES)

• Ukujonga kunye novavanyo lobungakanani bemophology yomphezulu

• Ukuchonga inkungu ye-wafer kunye nokutshintsha kombala

• Ubunjineli be-ATE kunye novavanyo lwemveliso kunye nophuhliso

• Uvavanyo lwemveliso ye-semiconductor, ukutshiswa kunye nokuthembeka kwesiqinisekiso sokuqinisekisa ukufaneleka kwe-IC